AMICRA Microtechnologies continuously strive to provide their valued customers with extraordinary, high-technological engineering services & products for the whole industry field of microelectronics.
AMICRA has developed advanced features and capabilities to support specific Advanced Packaging Markets in the backend assembly arena. AMICRA’s Die Attach solutions continue to enable the advanced packaging market to push the boundaries forward and beyond.
These unique innovative solutions enable their customer base to achieve some the most accurate die placement performance in the world today while maintaining bonding rates that are 2x and 3x faster than our closest competitor of the markets we serve, resulting in a value proposition that is second to none.
Advanced High Accuracy Die & Flip Chip Bonder, TCB (Thermocompression Bonding), In-Situ and Eutectic Bonding for AOC Optoelectronics, SiPh, PIC, VSCEL, Laser/Photo Diode, Lens Prism Attach, TSV, 3D, 2.5D, Stacked Die, MCM, FOWLP Fan-Out Fan-In, WLCSP, WLB, eWLB, RFID, and Sensor MEMS. High Speed Assembly, Laser based Substrate Heating, Autoloaders for 300mm Wafers & Large Substrates, UV Curing. HDS High Speed Precision Inline Dispensing Systems with Magazine or Reel, Lead or Frame. High Speed Automated and Semi-Automatic Inking Systems (AIS/SIS).